SK Hynix Inc. has announced the development of its next DRAM HBM2E (High Bandwidth Memory), which we know has been implemented in AMD graphics cards since the Radeon R9 Fury, which used the first generation of this memory, and NVIDIA has also implemented it for the first time in its Tesla P100 accelerators with HBM2.
SK Hynix announces its 460 GB/s bandwidth HBM2E memories
Now SK Hynix has announced that its next HBM2E memory will offer approximately 50% more bandwidth and up to 100% more capacity (density) than previous HBM2 memories. In this context, the new HBM2E chips developed by SK Hynix support over 460 GB/s (Gigabytes per second) on a frequency basis of 3.6 Gbps (Gigabits per second) per pin over a 1024-bit I/O bus (Inputs/Outputs). Globally, the use of 4 packets of HBM2E could reach a bandwidth of 1.84 TB/second.
Through Silicon Via (TVS), which consists of vertically stacked memory chips connected by microscopic cables (TVS), these memory chips can offer a maximum of 16 GB and stack a maximum of 8 16 Gigabit chips. In comparison, the current HMB2 memories offer a bandwidth of 256GB/s with a chip density of 8 Gigabit, stack the same 8 chips via TVS and achieve a density of 8 GB.
“SK Hynix has built its technology leadership since the first global launch of HBM in 2013,” said Jun-Hyun Chun, HBM Business Strategy Director. “SK Hynix will begin series production in 2020, when the HBM2E market will open, and continue to expand its leadership in the market for high-quality DRAMs.”
Remember that these memories not only offer double the density or capacity and higher bandwidth, but also low latency memory and low and efficient power consumption. But their use is not limited to what we normally call graphics cards, they are also implemented in markets such as high-performance GPUs, supercomputers, artificial intelligence, servers and other markets where they need leading-edge technology to ensure maximum data processing.
SK Hynix has said that mass production of HBM2E memories will begin in 2020, so their implementation in products such as GPUs and others will be counted this year, where we know AMD is a key partner.
Related posts:
Micron HBMnext, next generation graphics memory planned for GPUs in 2022
