Following the presentation of GDDR6X memory technology, Micron also announced the development of HBMnext, the successor of HBM2e.
HBMnext could be a tentative title for the next generation of HBM memories, as Micron directly refers to it as “The next generation of high-bandwidth memories”, so it is not yet clear whether HBMnext is a further development of HBM2e or a new name for (probably) HBM3.
Micron expects to produce JEDEC-compatible HBMnext memory in 4-stack 8Gb and 8-stack 16Gb densities. The manufacturer also stated that the data rate is expected to be 3.2Gb/s. For comparison, the NVIDIA A100 Tensor Core Accelerator based on HBM2e technology has a bandwidth of 2.4Gbps, while the AMD Radeon VII based on HBM2e has data rates of 2.0Gbps.
“Micron is fully involved in the ongoing standardization process at JEDEC. As the market demands more data, HBM-like products will flourish and produce ever greater volumes,” the company said.
Micron expects HBMnext to be available by the end of 2022. Since Intel Xe-HP (and HPC) and AMD Arcturus-based products are expected to be launched next year, they are not expected to include HBMnext.
Micron was neither the fastest nor the most powerful in the development of HBM’s video memory, but this time it was the first company to announce plans for the next generation of the technology, provisionally known as HBMNext.
After two generations of development, HBM is now entering the HBM2e phase, in which SK Hynix announced mass production as early as the beginning of July and Samsung is also actively advancing.