VIA Edge AI is a new development kit that has been announced, which is now available for purchase in two configurations in the VIA Embedded online store. We tell you all the features and the different purchase options.
VIA Edge AI, new AI development kit based on Android 8.0 BSP
The first configuration consists of a SOM VIA SOM-9X20 module and a SOMDB2 carrier board with 13MP CMOS camera module, with specifications that offer COB 1 / 3.06″, and a resolution of 4224 x 3136 pixels, for $ 629 plus shipping. The second configuration consists of a SOM module from VIA SOM-9X20, and a SOMDB2 carrier board for $569 plus shipping. The optional 10.1″ MIPI LCD touch panel is also available for $179 plus shipping and handling.
The VIA Edge AI Development Kit is optimized for intelligent real-time video capture, processing, and edge analysis. Application development is enabled by an Android 8.0 BSP, which includes support for the Snapdragon Neural Processing Engine (NPE) and full acceleration of Qualcomm Hexagon DSP to power artificial intelligence applications.
VIA has also announced that a Linux BSP based on Yocto 2.0.3 will be released in June 2018, as soon as more information and full specifications are released. VIA also offers a full suite of hardware and software customization services that accelerate system deployment and minimize development costs. Artificial intelligence is becoming increasingly important, so all companies want to take advantage of it.
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