TSMC announced the launch of its N4P process technology, the third major improvement to TSMC’s 5nm family, which offers higher transistor density and is also more energy-efficient, according to foreign media reports.
TSMC claims that N4P will offer many improvements in performance and power efficiency compared to the previous 5nm nodes. For example, N4P will offer 11% higher performance than first-generation N5 technology and 6% higher performance than N4 technology, 22% higher power efficiency than first-generation N5 technology, and 6% higher transistor density than N5.
The first products based on N4P process technology are expected to enter production in the second half of 2022.
Founded in 1987, TSMC is the world’s largest foundry semiconductor manufacturer. The company’s customers include Apple, Qualcomm, and Huawei. Due to the global chip shortage, the company will increase its capital expenditures from $30 billion to $31 billion by 2021, an upward revision of 10% to 20%.
Earlier this year in June, TSMC stated that the development of its 4nm process technology is progressing well and risk production is expected in the third quarter of 2021, one quarter earlier than previously planned (official test production will not take place until the fourth quarter of 2021). In addition, the company’s 3nm process technology will enter mass production in the second half of 2022 and is expected to be the most advanced technology in the world.
In July, industry sources said the company’s newly developed N5A process technology would be available in the third quarter of 2022.
This year’s iPhone 13 series will be powered by the A15 Bionic chip, which will be manufactured using TSMC’s improved 5nm process (N5P).
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