According to the media reports, Snapdragon 875 is said to have started production with TSMC’s 5nm process.
TSMC has begun production of Qualcomm’s flagship next-generation mobile platform.
The company will officially announce the product by the end of this year, and the new chip is expected to be fitted in high-end phones in early 2021.
The Snapdragon 875 mobile platform is manufactured on the 5nm process node, which saves energy, improves manufacturing speed, and increases transistors throughput.
In contrast to the mobile platform Snapdragon 865, the new mobile platform is expected to have an integrated modem, i.e. it will be 5G capable. X60 (the new iPhone 12 series will also use this modem).
The mobile platform Snapdragon-875 will continue to use the 1+3+4 CPU. This time, however, the Prime Core could be high-performance Cortex-X1. The peak performance of the X1 is 30% higher than that of the current A77, and for the same power consumption, the X1 is 20% faster than the A77, or 50% less power consumption for the same performance as its predecessors.
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