In the world of 3D NAND flash technology, the best way for chip manufacturers to increase the storage capacity of their chips is to add additional layers to their NAND structures. That’s why 4D NAND technology is so important.
SK Hynix announces that mass production of the world’s first 128-layer 1TB TLC 4D NAND chip has begun with 4D CTF (Charge Trap Flash) NAND Flash technology. SK Hynix 4D technology uses a structure known as PUC (Periphery Under Cell) Flash. The fourth dimension are the structures that have moved under the SK Hynix 3D NAND structure. Yes, that’s not really a 4D structure…..
With the company’s new 128-layer 1TB chips, SK Hynix can achieve higher productivity per wafer and offer 40% profit over the company’s existing 96-layer NAND 4D system. In addition, SK Hynix has claimed that this technology migration will cost 60% less than its previous technology change, resulting in surprising efficiencies.
SK Hynix plans to deliver its 4D NAND chips in the second half of the year with promising data transfer speeds of 1,400 Mbps at 1.2V. SK Hynix also plans to internally create a 2TB SSD with this type of NAND and a controller chip. The 16TB and 32TB NVMe SSDs are also for the enterprise market only. The company also plans to manufacture 176-layer chips in the near future.