The world’ s leading manufacturer of flash-based memory solutions, Toshiba Memory Corporation unveiled the development of a prototype sample of a 96-layer NAND BiCS QLC QLC chip, which features its patented 3D flash memory technology with 4-bit-per-cell QLC technology, enabling a significant increase in single-chip capacity to the highest level ever achieved.
Toshiba’s 96-layer NAND BiCS QLC memory enables 1.33 terabit capacity with a single chip
The Toshiba Memory Corporation announces that it will begin delivering the first batches of its 96-layer NAND BiCS QLC memory technology to SSD manufacturers in early September, with the intention of launching mass production next year in 2019. This new 96-layer NAND BiCS QLC chip enables a 1.33 terabit capacity with a single chip developed in conjunction with Western Digital Corporation. Using 16 of these chips in a single package will make it possible to build SSDs with a capacity of 2.66 TB, a real achievement in the industry.
In this way, Toshiba Memory Corporation is prepared to lead the product portfolio focused on addressing the huge volumes of data generated by mobile terminals and the expansion of SNS and progress in IoT. All this data must be used in real time, so SSD storage is essential because of its great advantage in speed over mechanical hard disks. Toshiba Memory Corporation will showcase packaging based on these 96-layer NAND BiCS QLC chips at the 2018 Flash Memory Summit in Santa Clara, California, August 6-9.
Toshiba Memory continues to improve memory capacity and performance and to develop new technologies to meet the diverse needs of the market, including the rapidly expanding data center storage market.
Source
Techpowerup
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