Samsung has presented a new model of memory HBM2 during the CES 2018. That receives the name of “Aquabolt,” Also, this new memory HBM2 can reach the 2.4Gbps with only 1.2V, so its energy efficiency concerning the first models of HBM2 has increased by 50%. As if that were not enough this new memory comes in 8-Hi stacks, or what is the same, encapsulated 8GB.
Samsung presents the HBM2 “Aquabolt” memory, the fastest on the market at 2.4Gbps@1.2V
The memory HBM2 predecessor “Firebolt” achieved 1.6Gbps at 1.2V, while with a rise in voltage to 1.35V 2Gbps were produced. So it is entirely explained not only the performance improvement but also the immense improvement in consumption of this new model.
With this new memory, a new graphics card using four of these 8GB packages. That would get a maximum of 32GB with a bandwidth of 1.2TB/s (if we consider a 1024bit bus). A figure that is far from what they can offer the current GDDR5. And to install the same amount would require 32 chips spread across the layers of the PCB.
“With our production of the first 2.4 Gbps and 8 GB HBM2. We are further strengthening our technological leadership and our competitiveness in the market,” said Jaesoo Han, executive vice president, sales, and marketing team at Samsung Electronics. “We will continue to strengthen our dominance of the DRAM market by ensuring a stable supply of HBM2 worldwide. According to the moment when customers launch the next generation system.”
Samsung would also have taken the opportunity to add thermal improvements to this second generation of HBM2 memory. Also, it comes with a more significant number of Thermal Bumps present among the eight die that forms each encapsulation. Also, a protective layer comes on the additional surface to improve the rigidity of the assembly.