As we read from ComputerBase, Rambus has announced the specifications of the new memories DDR5 and HBM3. These are the new generation of RAM for our computers and the new generation of memory stacked for GPU.
Rambus announces the specifications of the DDR5 and HBM3 memory
Regarding DDR5, Rambus tells us about a considerable increase in bandwidth. That is now up to speeds between 4800 and 6400Mbps compared to the average of 3200Mbps for DDR4 solutions. This specification launched by Rambus seems entirely reliable since JEDEC itself had recently confirmed similar numbers.
As for the HBM3 memory, the new generation of memory stacked. Also, the bandwidth is now 4000Mbps that is twice as compared to HBM2. And from that, we can say that the HBM2 memory is capable of reaching a speed of 256GB/s with a 1024 bit bus. And the new HBM3 should be able to reach 512GB/s per die on the same data bus. Such graphics cards like the current Radeon RX Vega that use HBM2 with two dies would see how their next generation doubles the available bandwidth.
The current situation has a significant shortage in the market of memory modules. That raises the price of RAM, SSD and also affects graphics cards. Also, there are stock problems due to the high request for NAND Flash memories. The leading cause is the smartphone market since the demand is high and there is no stock.
Despite all this, some manufacturers are already developing the memories of the future, in this case, RAMBUS is here with us.
Closing the issue, if we talk about 2x more in the memory bandwidth, HBM3 will offer some insane levels of performance, for the future hardware of GPUs. This increase in production allows a GPU with a single HBM3 chip to deliver similar levels of memory bandwidth as in the RX Vega 64 (which uses two HBM2 chips) or the R9 Fury X.
Both types of memory will come in 7nm nodes. And also we should not expect them to go at the market until at least 2020 or 2021.