Intel Lakefield, First CPU with 3D-Foveros released in 3DMark

Intel’s next 3D processor, codenamed Lakefield, recently appeared in the 3DMark database. Chip detective TUM_APISAK managed to take a screenshot of the 3DMark entry.

Intel Lakefield, First CPU with 3D-Foveros released in 3DMark

Intel Lakefield uses Foveros technology

Intel Lakefield will be the first processor to offer a 3D Foveros board from the chip manufacturer. This is a technology that essentially allows Intel to stack chips on top of each other, analogous to what memory manufacturers are doing with some new types of 3D NAND memory.

Though the 3DMark report states that the unidentified processor is equipped with five cores, this corresponds to the core configuration of the Intel Lakefield chips. As we remember, Lakefield uses a design similar to the large ARM architecture. Intel complements the powerful core with other slower, more energy-efficient cores.

In Lakefield’s case, Intel plans to equip the processor with a Sunny Cove core and four Atom Tremont cores. The manufacturer will produce these new chips with a combination of nodes. Intel uses the 10 nm node and the 22 nm node for the base chip.

3DMark identified the Lakefield processor with a clock frequency of 2,500 MHz but showed the five-core part with a 3,100 MHz core clock and a 3,166 MHz turbo clock. As with all pre-released silicon test deliveries, this may change during development.

Lakefield supports LPDDR4X memory speeds up to 4.266 MHz. Intel will stack the memory as a Pack over Pack (PoP) on top of the processor. TUM_APISAK states that the filtered processor has a physical score of 5,200 points, bringing it more or less to the same level as a Pentium Gold G5400. We will keep you informed.

David

David is the chief editor, publicist, and marketer by profession at Optocrypto. He is a Passionist for the technological world and wants to aware of all the benefits of the latest technology.

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