Via Overclock3D, it is confirmed that new flagship of Intel, Intel Core i9-9900K and i7-9700K will have soldered IHS. Eurocom, a leading developer of high-end gaming laptops and workstations, has confirmed that the next Intel Core i9-9900K and i7-9700K processors will be equipped with a drop-welded IHS, so these chips will offer significantly better thermal performance than their predecessors.
The use of a solder-based thermal interface between Intel CPU and IHS reverses Intel’s long-term decision to abandon solder on its major desktop platforms from Ivy-Bridge and creates the Delid process between overclocking enthusiasts and users who demand better performance and cooler systems.
These new Intel Core i9-9900K and i7-9700K processors come with gold solder to connect the matrix to the IHS, helping to improve CPU temperatures and also achieve higher overclocked frequencies. Intel Core i9-9900K is the first processor with 8 cores and 16 threads for the mainstream range, also capable of achieving a turbo speed of 4.9 GHz. Intel’s decision to return to soldering could be due to thermal problems with this processor when using thermal paste inside.
Eurocom also reported that they had Intel’s new internal product test units, confirming that the motherboards needed a BIOS upgrade to support Intel’s new ninth generation processors.
Certainly, users will appreciate Intel’s decision to reuse a high-quality solder on its processors and we are positive that temperatures for these processors will be much lower than their predecessors.