Finally, photos of Intel’s next-generation processors have been released. An overclocking group from Hong Kong showed the inside of the new Intel Core i9-9900K, and it comes with interesting information. Let’s see it.
The new i9-9900K, i7-9700K, and i5-9600K no longer use thermal compound between nozzle and IHS.
We recently told you that at least the i9-9900K would use soldering between die and IHS instead of the previously used inferior thermal compound. That would mean going back to the Sandy Bridge era and talking to AMD about it.
The picture shows how this high-quality gold-plated STIM solder is used in the i9 processor of the new Coffee Lake S platform. Well, the Chinese portal left this message on its Facebook page, where they showed the image of the i9-9900K they had taken, and a statement we liked to hear:
For those who are not sure what we mean by “solder” instead of “thermal paste”, the processor has two main components: the IHS, a metal plate that we see on the CPU and whose model parts are produced by screen printing. Below is the chip containing the other internal components of the CPU.
On the photo on the left we see the IHS that when it is removed, we can see the cube that appears in the second image. The point is that there must be a heat-conducting material between the nozzle and IHS. Today’s AMD processors use a high-quality solder, while Intel uses a poor thermal compound. Many users have done the ‘delid’, i.e. removed the IHS and replaced the thermal compound with a high-quality liquid metal.
It is good news to know that the new Intel processors are welded together again. They allow greater overclocking and much better temperatures and no longer require some users to perform the dangerous deciding process. Now it remains to be seen whether they will be extended to all other Intel processors, not just 9900K, 9700K and 9600K.
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