Intel announced today that it has expanded its wafer capacity to a 10nm manufacturing process. This was a concern for the company as this node will fuel the market next quarter with high-performance Tiger Lake notebook processors as well as the anticipated Alder Lake processors.
In response to customer demand, Intel has doubled its combined 14nm and 10nm manufacturing capacity in recent years. To achieve this, the company found new ways to deliver more performance within existing capacity through performance improvement projects. The video below shows this journey, which included reusing existing lab and office space for production.
“Over the past three years, we have doubled our wafer volume capacity, and that was a significant investment. We continue to invest in fab capacity to ensure we can keep pace with the growing needs of our customers,” said Keyvan Esfarjani, Intel senior vice president.
The company also accelerated its new 10nm manufacturing process this year. Intel currently manufactures 10nm products in high volumes at its Oregon and Arizona fabs in the U.S., as well as its fab in Israel.
“The progress of 10nm is going quite well. We have three high-volume fabs running full steam ahead to see how we can do more, better and faster and continue to support our customers.”