TSMC plans to invest $10.1 billion in building a new chip packaging and testing facility

TSMC, the world’s leading chip foundry, intends to invest $ 10.1 billion in the construction of a new chip packaging and testing facility.

TSMC plans to invest $10.1 billion in building a new chip packaging and testing facility

According to external media reports, TSMC plans to build a new chip packaging and testing plant, the associated buildings are scheduled for completion in May next year, the first phase will then go into production, the initial plan is to employ 1,000 people.

Like other chip manufacturing facilities in which TSMC has invested, the planned chip packaging and testing facility is a significant investment. TSMC plans to invest NT$33.2 billion, or about $10.15 billion, according to a report in foreign media.

If the reports, the chip packaging and testing plant, which has invested more than $10 billion, is TSMC’s second factory, which has recently invested more than $10 billion.

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On May 15, TSMC announced on its official website that it plans to build a new 5nm chip factory in Arizona, USA, construction of which is scheduled to begin in 2021 and production to begin in 2024. From 2021 to 2029, TSMC plans to invest $12 billion in this factory.