Apple, Huawei, and AMD can almost be described as the three companies that are most aggressive in applying advanced processes among the pure design fabless chip companies. Currently, 7nm has become the dominant power.
According to the latest news, TSMC’s 5nm yield has increased to 50% and mass production is expected in the first quarter of next year. Initial monthly production capacity will be 50,000 pieces, then gradually increased to 70,000 to 80,000 pieces.
TSMC’s 5nm yield has reached 50%: Apple A14, Kirin 1000, AMD Zen4 accelerate
The first batch of 5nm consumer products currently being introduced includes Apple A14, Hisilicon Kirin 1000 series, etc. It is said that they were tested in September.
As for AMD, the Zen 4 architecture processor is also at 5nm. The first probability will be given to the fourth generation EPYC processor codenamed “Genoa” and will be available as early as 2021.
According to official data from TSMC, the new 5nm chip based on the Cortex A72 core can deliver 1.8x logic density compared to 7nm (the first generation of DUV), increase speed by 15% or reduce power consumption by 30%. The SRAM of the same process is also very good and reduced.
In addition, thanks to the introduction of the Snapdragon 865, TSMC’s 7nm DUV will also present a bright transcript for next spring.