The new Samsung Galaxy S10 would use SLP (Substrate Like PCB) technology to reduce the space required by the various chips and expand the space for the battery. This way the Korean manufacturer should be able to guarantee the presence of a module with the higher capacities.
The SLP technology that Apple uses for the first time with the iPhone X is the realization of a printed circuit board that is able to collect a larger number of circuits and chips for the same board size. The possibility of stacking these components reduces the space required for implementation.
According to the latest rumors, the new Galaxy S10 series of smartphones which has three products theoretically will adopt exactly this type of solution, saving space that can be occupied by a larger battery. Also, it appears that Samsung is willing to use this technology only for the versions of new smartphones that will use Exynos chips. The company would indeed encounter problems in manufacturing SLP cards with Qualcomm chips.
Another factor that boosts the news is the fact that currently four of the ten largest suppliers of components used by Samsung for its smartphones are able to create SLP-designed cards. These include Samsung Electro-Mechanics, Daeduck GDS and Korea Circuit.