A rumor says that AMD is working on a new Milan-X stacked die design for its future processors.
Milna-X, new hybrid AMD die design with 3D stacking
X3D stacking technology was announced for 2020, which would feature a hybrid 2.5D and 3D die design.
According to Patrick Schur, the name of this technology could be Milan-X, which will likely include Zen-3 cores. This could mean that chips with this technology will not be used for future Ryzen desktops, but for other processors.
ExecutableFix is the other source that claims the codename is Milan-X, it also reveals that it will use the Genesis IO die, which is the codename for the current generation EPYC Zen 3 architecture.
The plan with Milan-X would be to increase bandwidth exponentially rather than increasing the number of cores. AMD has released a simplified diagram showing the evolution of the various AMD dies. This packaging technology used to be called X3D, which takes a hybrid approach.
All the major chipmakers are betting on a future with hybrid or multi-chip (MCM) designs. AMD has already used it with its Ryzen processors and Intel will implement it with its Alder Lake S processors, where it combines large, powerful cores with small, highly efficient ones.
The leaks could indicate that we might hear more about Milan-X during Computex 2021, where AMD is one of the hosts next week.