MediaTek presented its first 5G chipset, the Helio M70 modem, at the China Mobile Global Partner Conference in Guangzhou.
The Helio M70 is a multimodal chipset with support for 2G/3G/4G/4G/4G/5G
The Helio M70 is one of the industry’s first multimodal 5G integrated baseband chipsets.
The Helio M70 is a multimodal chipset that supports 2G/3G/4G/4G/4G/5G. It supports 5G radio (NR), autonomous (SA) and non-self-managed (NSA) network architectures, frequency bands below 6GHz, high-power user devices (HPUE) and other 5G key technologies.
According to MediaTek, it follows the new 3GPP Rel-15 specifications with a data rate of 5 Gbps, an important step in data transfer speed.
The chip supports dual LTE and 5G (EN-DC) connectivity and ensures that mobile devices are compatible with 4G/3G/2G when there are no 5G networks.
This simplifies the design of 5G devices and allows device manufacturers to develop mobile devices with a smaller form factor, better energy efficiency and a competitive advantage, MediaTek said”
“The team has worked with China Mobile to develop 5G, MediaTek is supporting not only the development of 5G standards but also the development of an ecosystem to support it by operators who need to slowly improve their headquarters to expand this type of connection around the world.”
The MediaTek Helio M70 baseband chipset is expected to be available in the second half of 2019, so many new smartphones will have 5G from that point.