As the world’s second largest supplier of smartphones, Huawei produces innovative parts for its devices. The Huawei semiconductor division, HiSilicons has become one of the largest integrated circuit manufacturers in Asia in recent years.
At the IFA, Huawei announced its latest mobile chip, the Kirin 980, which undoubtedly leads the market and will help the company to compete more effectively with Qualcomm and it’s Snapdragon 845, nowadays the best mobile processor.
To be specific, Huawei claims that its Kirin 980 is the first 7 nanometer (nm) mobile chip based on the Cortex-A76 chip from ARM and Mali-G76. It is the world’s first chip to include a modem for Cat.21 smartphones that supports speeds of up to 1.4 Gbps.
This is the first mobile chip to support LPDDR4X 2.133 MHz RAM technology. In that sense, the device has nearly 7 million transistors, and the most important of all is that its size is ideal for installation in any device, since it is similar to a small die-face.
Although Qualcomm’s dominance in this market is undisputed, there is no doubt that Huawei’s new chip is quite impressive in comparison to other smartphone processors. This is accompanied by the fact that Huawei guarantees that this device improves the bandwidth by up to 20 percent and reduces latency by 22 percent compared to the Snapdragon 845.
In addition to powering all the functions of a mobile phone, this powerful chip also provides higher energy efficiency, with 33 percent lower power consumption than the Snapdragon 845: In the photographic sector, Huawei promises that the Kirin 980 processes images up to 46 percent faster and 23 percent more efficiently than other models.
Undoubtedly, this is Huawei’s most ambitious project for the mobile chip market, and it will come when Huawei’s next smartphone, Magic 2, and its next Mate series are released.