A few hours ago, Chinese industry giant Huawei announced that its latest 5G-capable HiSilicon-Kirin single crystal system will be launched on March 30. According to Huawei’s Honor brand, the new Kirin 820 5G chips will be introduced and used in the Honor 30S smartphone.
Of course, the Kirin 820 chip with a built-in 5G modem should support next-generation networks with non-autonomous (NSA) and standalone (SA) architectures. The upcoming SoC Kirin 820 will be based on Huawei Da Vinci’s proprietary 7nm process architecture. It is expected to include ARM Cortex A76 cores and a Mali G77 graphics accelerator. It will also use new signal processors (ISP) and neuro block (NPUs) with support for Kirin Gaming Plus gaming technology.
According to GeekBench 4.0, Kirin’s performance was 820 3490 points in single-thread mode and 11,200 points in multithread mode. These results mean that the upcoming Kirin 820 midrange chip is consistent with last year’s flagship Qualcomm Snapdragon 855 processor; definitely good news for Huawei. The new SoC also significantly outperformed the old Kirin 980 in both single-core and multi-core tests. The Kirin 820 is likely to follow the same beaten path as last year’s Kirin 810: it is likely to be a large and quite powerful processor for Huawei and Honor in the midrange.
We have already told you about the preparations for the launch of the Honor 30S smartphone itself. The device has 6 GB of RAM, a 128 GB drive, a lateral fingerprint scanner and a rechargeable battery with 40 W speed.
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