Ryzen 5000 could be compatible with AMD 300 series chipset

Ryzen 5000

It seems that AMD is working on making Ryzen 5000 processors available for installation on motherboards with AMD 300 series chipsets. This will allow many users to upgrade their systems without having to replace their motherboards. AMD will allow Ryzen 5000 processors to be installed on motherboards with 300 series chipsets. A few weeks ago, … Read more

GIGABYTE B550 AORUS will possess three M.2 PCIe 4.0 SSD slots

With the announcement of the AMD B550 chipset, many manufacturers are preparing their own motherboards. And the latest entry is the GIGABYTE B550 AORUS, which comes with the added bonus of no less than 3 slots for SSD M.2 PCIe 4.0. GIGABYTE B550 AORUS will have three M.2 PCIe 4.0 SSD slots The report points … Read more

AMD Ruyi: a PC console with a more powerful SoC Ryzen than PS4 Pro

For several years, AMD has focused heavily on semi-personalized GPUs, a very successful approach that has enabled it to make a name for itself on PS4 and Xbox One as well as on Xbox One X and PS4 Pro. Sunnyvale continues to focus on developing its GPUs as semi-personalized models to cover key technology areas … Read more

Huawei Mate 20X smartphones would delight gaming enthusiasts

October will be a special month for Huawei. This is because the Chinese company will present a new batch of devices, the Huawei Mate 20, and yes, following the launch of the Huawei Mate 20 Lite, the company is preparing for a more mobile Mate family. One of them will be the Huawei Mate 20X, … Read more

Microsoft’s HoloLens 2 will use Qualcomm’s new XR1 chip

Microsoft is preparing a new version of its mixed reality HoloLens glasses. Everyone is talking about when HoloLens 2 will arrive, how much it will cost and what exactly is hidden inside. And we may have some answers, thanks to a source close to the project. HoloLens 2 will bet on Qualcomm’s new chip Some … Read more

Milan-X, new AMD hybrid die design with 3D stacking

A rumor says that AMD is working on a new Milan-X stacked die design for its future processors. Milna-X, new hybrid AMD die design with 3D stacking X3D stacking technology was announced for 2020, which would feature a hybrid 2.5D and 3D die design. According to Patrick Schur, the name of this technology could be … Read more

AMD forwards partnership with Adastra supercomputer

The supercomputer “Adastra” is based on an HPE Cray EX system with AMD processors. The first partition will arrive in spring 2022 with EPYC Zen 4 processors in 5 nm (Genoa), 768 GB DDR5, and a 200 Gb/s network link. The second is scheduled for late 2022 with third-generation EPYC processors and Instinct MI250X OAM … Read more