Many of these rumors had already been heard, and now another roadmap has been published confirming this information: Intel will launch Comet Lake S in early 2020, replacing the current LGA 1151 platform.
This platform will use the 400 series motherboards with the LGA 1200 socket and support processors with up to 10 cores and 20 threads with 125W TDP. There will also be other models with 65W TDP and even ultra low power models with 35W TDP, like the T-line we have seen so far.
Unlike AMD, who chose to integrate PCI-E 4.0, Intel will retain PCI-E 3.0 in its new platform and wait directly for PCI-E 5.0, which would arrive with Ice Lake-S.
Comet Lake S features:
Hardware 10-bit HEVC decoding/encoding
Hardware decoding of the 10-bit VP9 format
Premium UHD / 4K content support
Built-in USB 3.1 Gen 2 (10 Gb/s)
Integrated Intel Wireless AX Support
Gigabit Wi-Fi 802-11ax (160MHz) and Bluetooth 5
Support for next-generation Intel Optane memory
Support for Thunderbolt 3 technology
Support of Intel Smart Sound Technology with Quad-Core Audio DSP
Support for modern stand-by mode
A big change in the platform would be the number of available PCIe tracks. Up to 46, I/O tracks are mentioned in the platform details, of which 30 are provided by the chipset. This means that the CPUs would still have 16 PCIe tracks, but the PCH would have a larger number.
All of these are very interesting facts, although it took Comet Lake at least 6 or 9 months to see the first chips in the trade. We will keep you updated.
These new processors will begin production in the final weeks of 2019 and will be announced in the first quarter of 2020. It would not be surprising to see an announcement during CES, although there is also the possibility that Intel will wait a few more weeks.
Source: TechPowerUp