At the moment we only have motherboards with the AMD X570 chipset for Ryzen processors on the market, but the medium and high-end versions, i.e. the B550 and A520, are still missing. A report from ChinaTimes reports that these two chipsets will go into mass production in the first quarter of this year.
Backplanes with the B550 and A520 chipsets will go into production shortly
The two chipsets to be produced include the B550 midrange chipset and the A520 entry-level chipset. The AMD Ryzen platform currently has AM4 motherboards based on the X570 chipset, which are significantly more expensive due to their high-end/enthusiastic positioning.
We have seen a significant price increase in X570 motherboards compared to the X470 and X370, and while motherboard manufacturers are aggressively targeting the market below $200 with their new X570 designs, there is still a large market below $150 that needs to be covered by the new batch motherboards that debuted with Ryzen 3000.
According to sources, ASMedia would execute orders for the Supermicro B550 and A520 chipset and go into mass production in the first quarter of 2020. Retail products based on these chipsets are expected to hit the shelves in the first half of 2020, allowing us to see them in action at this year’s Computex. This will not be the first time we will see budget options at Computex, as several AMD board members have released their B450 lines in 2018.
The B550 chipset is expected to use a PCIe 3.0 interface instead of the new 4.0, so there will be a major limitation when we consider using SSDs that use this new interface.
Orders for AMD 600 series chipsets, including the flagship X670 chipset, are also expected to go into mass production in the second half of 2020.