Mass production of the first 5 nm products on the TSMC production line has already been mastered.
TSMC
Huawei is already testing processors at 5nm as a prototype of the next Kirin
TSMC has been producing its 5nm EUV process of daring production for 6 months to polish it before mass chip production begins in 2020, and new reports have it that Huawei was involved in these startling productions with a prototype of the next Kirin. According to reports, the Kirin 1000 would be based on Cortex … Read more
Intel will use 6nm TSMC nodes in 2021 and 3nm in 2022
As for semiconductor technology, Intel’s 10 nm was mass-produced, but the company also stated that its production capacity will not be as large as 22 nm and 14 nm, which could be an important sign. That’s why Intel is thinking about TSMC and will deploy its 6 and 3 nm nodes in the coming years. … Read more
Following Intel, AMD risks suffering due to issues with TSMC production issues with 10, 12 and 16 nm nodes
A few days ago, we reported that TSMC experienced delays in the production of chips at 7 nm due to strong market demand. Apparently, this problem would also shift to its other nodes of 10, 12 and 16 nm. The delay of 7 nm would be multiplied by 3, i.e. from 2 to 6 months. … Read more
Production of Kirin 1020 for Huawei Mate 40 is still guaranteed from TSMC
Hopes for Kirin 1020 are still green from TSMC. In recent weeks, we have seen a stricter US regulatory network around Huawei, which has pushed even manufacturers like TSMC to stop receiving orders from Huawei, a message that the Taiwanese manufacturer attributed to a simple lack of production capacity. Given the doubt, Huawei Mate’s next-generation, … Read more
TSMC and AMD plan on an optimized 5nm node for Zen 4 and RDNA 3
According to recent industry reports, AMD would work with TSMC to develop an adapted version of the 5nm node specifically for their 2021 products. This would allow them to optimize the process for their products to reduce power consumption and maximize frequencies. This is something Nvidia has been doing for several years and has proven … Read more
AMD would implement a 3D packaging design to make it’s CPUs more powerful
The Asian website Nikkei revealed that TSMC is working closely with AMD, Google, and other major companies to develop a new way to make processors more powerful. This would be made possible by 3D packaging (3D stacking), or 3D stacking for short, in which the components of a chip can be stacked both vertically and … Read more
TSMC 3nm node expedites distribution by 2022
TSMC will begin mass production of its 5nm chips in the second quarter of next year and, as announced by the company, they are well on track to produce their first 3nm chips by 2022. TSMC 3nm node advances the delivery by 2022 The company’s original plan was to start supplying the first chips manufactured … Read more
TSMC 5nm yield has climbed to 50% owing to AMD and Apple adaptation
Apple, Huawei, and AMD can almost be described as the three companies that are most aggressive in applying advanced processes among the pure design fabless chip companies. Currently, 7nm has become the dominant power. According to the latest news, TSMC’s 5nm yield has increased to 50% and mass production is expected in the first quarter … Read more
TSMC, being the world’s largest contract chip manufacturer now equipping A12 chips for Apple
As Apple has reduced its dependence on Samsung’s semiconductor foundry services, TSMC has been manufacturing chips on Apple’s blueprint. It plans to start production of the 7nm chip in the first quarter of 2018. In contrast, Samsung says it will launch a 7nm chip by the end of 2018. TSMC has about 470 customers worldwide … Read more