Micron has announced that the company is about to begin series production of its fourth-generation 3D NAND storage devices. Based on the company’s new Replacement Gate (RG) architecture, the memory manufacturer is preparing to begin production in the current quarter, i.e. this quarter. Micron begins mass production of 128-layer 3D NAND As Micron stated, the … Read more
Micron today announced its SSD X100, the world’s fastest 9GB/sec sequential SSD for both read and write and mixed workload with up to 2.5 million random IOPS. Micron believes that the new device, which uses PCIe 3.0 x16, offers an impressive 8-microsecond latency that is faster than the 10-microsecond latency of Intel Optane SSDs. The … Read more
In the latest profit announcement, Micron has announced that the company will finally launch its first HBM2 DRAM for high-bandwidth applications later this year. These devices will be mostly GPUs and the flagship network processors that have turned to HBM over the last five years for their growing bandwidth needs. HBM2-DRAM, Micron launches new memory … Read more
The inclusion of Huawei in the list of entities of the US Department of Commerce and the resulting restrictions on cooperation with the Chinese giant made it significantly more difficult for US-based companies to do business with Huawei. However, it did not make it completely impossible, as companies could apply for special licenses. Micron was … Read more
Micron has begun sampling LPDDR5-based uMCP products. In a press release today, Micron announced that it has begun sampling the industry’s first low-power DDR5 DRAM (LPDDR5 DRAM) Universal Flash Memory (UFS) multi-chip package (uMCP). The new uMCP5 package can combine low-power DRAM with NAND and onboard controllers and requires 40% less space than a two-chip … Read more
