Samsung, one of the largest DRAM manufacturers, has announced that it will increase its production of its 8GB HBM2 chips. That is to serve the growing demand for this product in various markets such as high-end graphics cards, servers or networked systems.
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Jaesoo Han, vice president of Samsung and head of the brand’s memory team, commented:
“By increasing the production of the industry’s only available 8GB HBM2 solution, we are striving to ensure that global IT manufacturers have sufficient supplies for the timely development of new and upgraded systems. We will continue to offer more advanced HBM2 lines, working closely with our global IT clients. “
HBM2 8GB Samsung 256 GB/s per slot
The HBM2 8GB Samsung chips are composed essentially of eight sorts. And each one buffer at the bottom which interconnects. Thanks to TSV and micro connections. These new stacked DRAM chips are capable of delivering a bandwidth of 256 GB/s per slot. Unlike the 32GB/s per slot that is capable of providing current GDDR5 chips. There is no need to mention that a single chip is capable of replacing 8 GDDR5 memory chips in the PCB of our graphics cards thus significantly reducing the space required.
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Most likely we will see this new memory from Samsung on upcoming NVIDIA graphics cards next year. As this stacked memory configuration is designed to occupy at least two slots, that means at least 16GB of memory or 32GB of memory if you Use four. These new memory chips will be available for the first half of 2018.