Qualcomm Announces QCC514X and QCC304X Audio Chips with New True Wireless Mirroring Technology

Qualcomm has announced its two upcoming audio chips for the mid- and high-end market that integrates new TrueWireless Mirroring technology into the wireless headphones models announced today.

Wireless headsets are booming in the interest of making life easier for users by connecting via Bluetooth and offering an often questionable range, at least for the time being. Qualcomm has improved its audio chips over the years and is now entering the third phase of the development of its wireless headset technology, which will extend from 2020 to 2024. The two new audio chips are the Qualcomm QCC514X (high-end) and QCC304X (low- and mid-range), both of which incorporate the new TrueWireless Mirroring technology.

This technology focuses on several improvements for the user, starting with hybrid active noise reduction (ANC), which features lower power consumption and allows this option in the low-end range. Another improvement is continuous when one of the two in-ear earphones is removed, with the remaining in-ear earphone taking immediate control. For the high-end chip, the QCC514X, support for Always-On Voice is added to enable certain functions with a single word, while for the mid- and low-end chip, the QCC304X, the activation of the Voice Assistant is activated with the push of a button.

These new Qualcomm audio chips focus on maintaining high audio quality at a low power cost and adding features not previously found in button headphones.