Intel Comet Lake-S Roadmap,10 Cores / 20 Threads with LGA 1200 socket and the 400 series chipsets

A leak has just occurred around the next Comet Lake-S processors. Intel is preparing 10 physical cores for the consumer segment. Availability is expected in the first quarter of 2020 with a new socket and new chipsets.

Intel Comet Lake-S Roadmap,10 Cores / 20 Threads with LGA 1200 socket and the 400 series chipsets

A leak has just occurred around the next Comet Lake-S processors. Intel is preparing 10 physical cores for the consumer segment. Availability is expected in the first quarter of 2020 with a new socket and new chipsets.

The Comet Lake S processor series will enable Intel to offer up to 10 physical cores in the mainstream segment. However, the reaction to the Ryzen 3000 requires a motherboard change. The giant plans to introduce the LGA 1200 socket and the 400 series chipsets. These new features are expected in the first quarter of next year.

Of course, there will also be a “K” series. These chips are aimed at players and overclocking enthusiasts with the presence of an unlocked multiplier. The thermal envelopes will rise to 125 watts, which promises a high frequency. This will probably be the last 14 nm optimization at Intel.

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Intel Roadmap – Comet Lake-S (leak)

Comet Lake-S will generally be offered for sale in early 2020. As already mentioned, the introduction of a new socket, the LGA 1200, requires a mandatory motherboard change. There will be no backward compatibility with the existing system due to a different processor format. For some, the use of 14 nm, which is very well mastered by Intel, will provide a high frequency, so the adoption of 10 nm will be compromised in the near future. The gains in the CPI would not compensate for the frequency difference, especially in the high-performance segment of our desktops.

Intel Comet Lake-S Roadmap,10 Cores / 20 Threads with LGA 1200 socket and the 400 series chipsets

Intel Comet Lake-S, the ultra-optimized 14 nm

Coming back to the Comet Lake-S offering, it will be organized around three main stages of the TDP, namely 125W, 65W and 35W. The latest developments such as WiFi 6, USB 3.1 and Thunderbolt 3 are available.

While performance will be an important element, pricing will be critical to ensure a competitive offer over the recently released Ryzen 3000. AMD is addressing this aggressive issue and there is no sign that its policy will change.

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