As hardware becomes more and more powerful in a diminishing space, gaming notebooks get pretty hot while playing, so any small improvement in cooling is always welcome. In this case, it’s time to talk about Asus, who have not only improved their heatsinks, but have also developed a new technique in which liquid metal is applied to the CPU and GPU instead of the conventional heat-conducting paste to achieve a more efficient heat transfer to the heatsink.
Liquid Metal Technology | ROG
This new Asus technology makes it possible to place the right and necessary amount of liquid metal required for each component and to reserve it before mounting the heatsink, allowing a much higher heat transfer than with any conventional thermal paste.
Asus uses the liquid metal Thermal Grizzly Conductonaut, the best liquid metal currently available on the market. This has a heat transfer of 73 W/mk, while a conventional thermal compound such as Arctic MX-4 has 8.5 W/mk, so the difference is huge.
This technology is already used in the new ROG (Republic of Gamers) notebooks with Intel Core 10 generation processors and GeForce RTX Super graphics cards and may be used in other products in the future.