AMD Ryzen 5000 Series processors will be launched next month and performance on IPCs in Zen 3 architecture looks set to experience a very good resurgence with the 7nm manufacturing process.
AMD Ryzen 5000 ‘Zen 3’ uses 7nm EUV process
The first rumors about Zen 3 processors tell us that they will come up with a surprise, and that is the use of the 7 nm EUV process, which is one of the three versions of TSMC’s 7nm process.
Regarding the question of whether Zen 3 will be included in the EUV process, AMD’s official position was very vague, they only commented that they would use an improved version of the 7nm process, but nothing was ever said about EUV, which was removed from the official roadmap.
However, it was recently mentioned in the Taiwanese media that AMD’s Zen 3 will use the EUV lithography process.
Of course, this statement still needs to be confirmed by AMD, AMD’s position on this issue is also more subtle, the roadmap does not mention the TEU, but this information could clarify this ambiguity.
For TSMC the 7nm EUV process has only 4 layers of EUV, which will increase with the step towards 5nm, where the layers will increase. It is commented that with the step to 5nm the EUV layers will reach about 14, and with the 3nm it will increase to 20 layers.
The AMD Ryzen 5000 series will be launched on November 5th.
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