To accelerate the production of 14nm-based Intel processors, the company has transferred part of its processor production to TSMC and has also divested the production of Celeron, Pentium, Atom and other similar processors as well as some chipsets manufactured by Taiwanese semiconductor manufacturers. It appears that TSMC will produce the Intel B360 chipset, which will be renamed B365 as it is based on 22nm lithography.
Official Intel documents talk about B365, a new chipset that we had already heard in rumors and that would be something like the H310C chipset: B360 is also an infusion at 22nm due to lack of capacity in the 14nm node.
The reference to the chipset can be found on the Intel site by accessing the release notes of the chipset driver (link). The update 10.1.17809.8096 is “Renamed A2CC device to LPC controller (B365) of the 300 series chipset family”, in which the B365 chipset is explicitly mentioned.
While this confirms the existence of B365, it does not confirm that it is manufactured at 22 nm. Let us remember that Intel has saturated its lines of 14nm, and therefore there are some chipsets with 22nm. We have already seen it with the H110C, and therefore it is assumed that the same will happen with the B365.
The difference of the properties between the B360 @ 14nm and the B365 @ 22nm is none, since the two chipsets have exactly the same properties, only the lithography changes. In addition to the change in lithography, we could see a slight increase in consumption and temperatures, which is completely insignificant.
The chipset is expected to be released shortly as manufacturers are already working on models based on it. The PRIME B365M-A model, recently filtered by Videocardz, is known to be ready for Asus. The other companies may already have models ready for official lanch, but they are not yet known.
The B365 is not the first chipset to be modified and is that we’ve seen the company convert the H310 @ 14nm to the H310C @ 22nm before. In addition, ASUS has already announced the B365M-A motherboard.